8. 1969_02_21_MRC DIP PANEL 6 x 25 SPECIFICATION FEATURES, 1969 February 21
File — Box: 3
Identifier: Box 3
Scope and Contents
A unique packaging methodology was developed by MRC Engineering to mount the newer Dual-In-Line (DIP) Integrated Circuits (replacing circular TO-5 & TO-18 packages) onto a logic panel for the custom-built Model 650-E Scanner for Document Reading Services, Ltd., an MRC Customer in England. This 5-page Tech Report, and two large MRC Drawings describes the concept. Copy in a pocket folder
Dates
- Creation: 1969 February 21
Creator
- From the Collection: McMillin, John V. (Person)
Conditions Governing Access
This collection is open for research.
Extent
From the Collection: 14.50 Linear Feet
Language of Materials
From the Collection: English
Repository Details
Part of the University of Iowa Archives Repository
Contact:
100 Main Library
University of Iowa Libraries
Iowa City IA 52242
319-335-5921
lib-spec@uiowa.edu
100 Main Library
University of Iowa Libraries
Iowa City IA 52242
319-335-5921
lib-spec@uiowa.edu